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Packaging and pcb board design engineer

Sérézin-du-Rhône
Quobly
Design
Publiée le 19 juin
Description de l'offre

Quobly aims to have a strong impact on society by providing cost-effective universal quantum processors to solve currently unsolvable problems.


Founded in 2022, Quobly is a fast-growing start-up located in Grenoble's vibrant and multidisciplinary ecosystem. The company relies on the CNRS Neel Institute and CEA-Leti and benefits from the dynamic of strong links between research and industry.


Quobly is looking to grow his team on the Packaging and PCB board design for his chip beyond 100 Qubit design.


The target is to design, develop and subcontract PCB board fabrication taking into account the specific requirement of the chip.

The requirements are related to RF signal integrity, thermal management and the cryogenic environment the chip are working on.


What awaits you every day at Quobly within the Integration Team:


Mission

* You will develop, design and subcontract PCB board based on the specifications of the chip
* You will define and propose semiconductor packaging solutions for the Qubit chip
* You will propose PCB partitioning to find the best compromise between testability and versatility


Collaboration

* Collaborate with and learn from talented people from many countries and backgrounds (software, hardware design, quantum physics, characterization, measurement, quantum information theory) in a culture of transparency and autonomy.
* Work hand in hand with members of our technical teams.
* Contribute to the success of the industrial collaborations with CEA, CNRS and STMicroelectronics.


You are special because:

* You have experience in designing PCBs for RF applications upto 20 GHz, including impedence-controlled traces, RF shielding, ground plane strategies, and signal integrity.
* You have experience with matching networks and S-parameter analysis.
* You have experience with RF simulation tools and PCB design tools.
* You have experience on typical semiconductor packaging (favored)
* You have experience on thermal management at package and board level (a plus).
* You are familiar with RF test equipment such as VNA, spectrum analyzer, signal generator etc.
* You have knowledge of cryogenic (1K) environment .


If you’re missing some skills but have a strong background, drive, and adaptability, we encourage you to apply! Your expertise and proactive approach can make a real difference.

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Accueil > Emploi > Emploi Culture > Emploi Design > Emploi Design en Rhône > Packaging and PCB Board Design Engineer

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